The mission of pillar one is to develop or to stimulate the development of technologies required to construct highly integrated and compact detector heads. This includes high-performance mixed-signal as well as 3D-ASICs for signal processing, high-Z and edgeless sensors, thru-silicon-vias (TSV), innovative construction materials (for reduced a materials budget) and advanced packaging. The vehicle to achieve these goals is the so-called Helmholtz Cube, which can be optimized component-by-component, leaving the rest of the system unchanged.
Work Packages
| Mixed Signal and 3D-ASICs |
| 3D and High-Z Sensors |
| Electronic Pack |
| Advanced Materials |
